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The aerospace industry is facing immense challenges due to increased design complexity and higher levels of integration, particularly in the electrification of aircraft. These challenges can easily impact program cost and product time to market. System electrification and electromagnetic compatibility (EMC) have become critical issues today. In the context of 3D electromagnetics, EMC electromagnetic compatibility ensures the original equipment manufacturer (OEM) that radiated emissions from various electronic devices, such as avionics or the entire aircraft for that matter, do not interfere with other electronic products onboard the aircraft.

Traditional ground vehicle architectures comprise of a chassis connected via passive, semi-active, or active suspension systems to multiple ground wheels. Current design-optimizations of vehicle architectures for on-road applications have diminished their mobility and maneuverability in off-road settings. Autonomous Ground Vehicles (AGV) traversing off-road environments face numerous challenges concerning terrain roughness, soil hardness, uneven obstacle-filled terrain, and varying traction conditions. Numerous Active Articulated-Wheeled (AAW) vehicle architectures have emerged to permit AGVs to adapt to variable terrain conditions in various off-road application arenas (off-road, construction, mining, and space robotics). However, a comprehensive framework of AAW platforms for exploring various facets of system architecture/design, analysis (kinematics/dynamics), and control (motions/forces) remains challenging.

This document defines the characteristics necessary to standardize the airborne recorder download file format in order to facilitate data import, transcription, and exchange. A standardized data format will reduce the variety of readout equipment required for airborne recorder data transcription. This document defines the detailed architecture of the Recorder Standard Output (RSO) file. The architecture is a tagged file structure within which many different files and their formats can be supported. The structure is necessary to support newer recording requirements for flight data, data link, audio, and image recording. This structure is intended for use with all civil recorders and should support use with military recorders.

Abstract The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly.